Opportunities in thesystem in package market have evolved through a number of stages. Lucintel has found the future of this market to be promising; the system in package market is expected to grow at a CAGR of 8% to 10%. In this market, RF front end is expected to remain the largest device type, and consumer electronics segment is expected to remain the largest application. Players can benefit from the available opportunities like increasing demand in consumer electronics and increasing presence of major players.
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Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group are some of the companies profiled in this report.
Some of the features of this report:
- Market size estimates: System in package market size estimation in terms of value ($M) shipment.
- Trend and forecast analysis: Market trend (2015-2020) and forecast (2021-2026) by segments and region.
- Segmentation analysis:System in package market size by packaging technology, device type, package type, packaging method, and application.
- Regional analysis: System in package market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
- Growth opportunities: Analysis on growth opportunities in different device type and regions of system in package in the system in package market.
- Strategic analysis: This includes M&A, new product development, and competitive landscape of system in package in the system in package market.
- Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
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