MegaChips to Highlight 16nm Platform Technologies for Next-Generation ASICs at DAC 2018
MegaChips to Highlight 16nm Platform Technologies for Next-Generation ASICs at DAC 2018 Latest technologies enable creation of smaller, faster and smarter products for innovation-driven markets - automotive, communications, factory and office automation |
[20-June-2018] |
SAN JOSE, Calif., June 20, 2018 /PRNewswire/ -- MegaChips, a global semiconductor company specializing in ASICs and Application Specific Standard Products (ASSPs), today announced it will feature 16nm platform technologies for next-generation ASICs at DAC 2018, booth #2146, June 25-27, at Moscone Center West in San Francisco. These technologies allow engineers to achieve the dense integration, power savings, and cost advantages demanded by today's highly competitive markets including automotive, communications, factory and office automation.
MegaChips has partnered with TSMC, UMC, and other leading foundries to bring our advanced mixed-signal IP to the latest 16nm platform technologies with 50% faster and 60% lower power than 28nm process technologies. This opens up a whole new world of innovation for factory robots and optical networks. The DAC 2018 16nm lineup includes:
About MegaChips Corporation
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Company Codes: Tokyo:6875 |
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