ZutaCore and Compal Transform AI Data Center Cooling at Yotta 2025
ZutaCore and Compal Transform AI Data Center Cooling at Yotta 2025 |
| [08-September-2025] |
Breakthrough waterless, two-phase liquid cooling delivers unmatched efficiency, reliability, and sustainability for next-generation AI workloads LAS VEGAS, Sept. 8, 2025 /PRNewswire/ -- In response to AI's surging power demands and unprecedented computing needs, Compal, a pioneer in high-performance AI server platforms, and ZutaCore®, a leader in waterless direct-to-chip liquid cooling, have joined forces to create integrated server and cooling solutions that revolutionize data center efficiency, reliability, and sustainability. The collaboration will be on display at Yotta 2025, booth #316.
"Partnering with ZutaCore allows us to bring truly transformative cooling technology into our high-performance server portfolio," said Alan Chang, Vice President of the Infrastructure Solutions Business Unit, Compal. "The combination of our engineering expertise and ZutaCore's HyperCool® platform enables data centers to scale AI workloads more sustainably and cost-effectively." My D. Truong, ZutaCore CTO, said the partnership delivers the best of both technologies designed for AI's most demanding workloads—from hyperscale data centers to the edge. "With Edge AI accelerating faster than ever, cooling becomes a critical enabler of real-time intelligence,' he said. "Our waterless two-phase direct-to-chip cooling uses a non-conductive, non-corrosive dielectric fluid that instantly removes heat at the source, keeping processors cool even in the most constrained edge environments. Unlike water-based systems, it is 100% IT-safe—even in the unlikely event of a leak, it will not harm hardware. This breakthrough allows operators to deploy AI closer to where data is generated, while maximizing performance per rack, slashing energy costs, and advancing sustainability goals without compromising reliability." From Innovation to Implementation: Next-Generation Platforms At Yotta 2025, attendees will see two Compal platforms built with ZutaCore's HyperCool® waterless liquid cooling, proving how advanced cooling translates into real-world gains in density, efficiency, performance and reliability.
"PUE and pPUE are the industry's gold standards for energy efficiency," noted Truong. "A perfect score of 1.0 means every watt of power goes into computing, with none wasted on cooling. Reaching values this close to 1.0 is a breakthrough that redefines sustainable, high-performance data center operations." ZutaCore's Cooling Technology Brings Game-Changing Benefits ZutaCore's waterless, direct-to-chip liquid cooling, with its exclusive pool boiling technology, represents a fundamental shift from traditional air or single-phase liquid cooling. Instead of moving heat away gradually, it removes it instantly at the source by turning liquid into vapor, keeping processors consistently cool even under the most extreme workloads. For operators, the impact is immediate:
About Compal Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com
SOURCE COMPAL ELECTRONICS INC. | ||
Company Codes: Taiwan:2324 |
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