Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions
Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions |
| [17-June-2026] |
Market Leaders Including Cisco, MediaTek, NVIDIA, and Samsung Foundry Key Highlights
SUNNYVALE, Calif., June 17, 2026 /PRNewswire/ -- Synopsys, Inc. (NASDAQ: SNPS) today announced availability of its first Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics are becoming critical constraints at advanced nodes and in multi-die architectures, requiring a unified EDA and multiphysics approach. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. Validated by market leaders, these solutions improve predictability and accelerate convergence for AI and high-performance computing systems.  "Multiphysics is fundamentally reshaping how advanced semiconductor designs are engineered, driving a shift from costly overdesign to integrated, system-aware co-design," said Sanjay Bali, Senior Vice President of EDA Product Management and Strategy at Synopsys. "Our Multiphysics Fusion portfolio unifies Synopsys and Ansys technologies to embed physics directly into digital and analog workflows, enabling engineering teams to design across domains with fewer iterations, improved productivity and more optimized silicon for next-generation systems." Enabling Multiphysics‑Aware Co-Design Across the Chip Design Flow
Demonstrating Real-World Impact with Market Leaders "As multi-die integration becomes increasingly important for high performance compute platforms, it's critical we make the right system-level design decisions early in the development process," said Harrison Hsieh, vice president at MediaTek. "By unifying multiphysics analysis and timing signoff across digital, analog, photonic and multi-die designs, Synopsys Multiphysics Fusion technology gives us earlier insight into cross-domain interactions across silicon, advanced packaging and optical domains, which makes it possible for us to improve predictability, reduce late-stage rework, and achieve a runtime that's 10 times faster than before." "Advanced AI and high-performance computing platforms are pushing chip design beyond traditional workflows, and to deliver greater performance, efficiency and reliability at scale, multiphysics-aware co-design is essential," said Tim Costa, vice president and general manager of computational engineering at NVIDIA. "Synopsys is using NVIDIA accelerated computing and CUDA-X libraries, including cuDSS, which delivers up to 13x GPU acceleration, to scale increasingly complex SPICE simulations, electromagnetics, and power-integrity workloads. In addition, Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs." "Accurate timing signoff at advanced nodes requires a unified approach that accounts for IR drop, thermal, and stress effects directly within timing analysis," said Hyung-Ock Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics. "Synopsys' Multiphysics Fusion technology provides a unified, all‑aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. This is increasingly important as we pursue higher levels of integration, performance, and reliability across advanced process and multi‑die technologies." In addition, the Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization—helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime. Availability Resources
About Synopsys © 2026 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners. Forward-Looking Statements
SOURCE Synopsys, Inc. | ||||||||||||
Company Codes: NASDAQ-NMS:SNPS | ||||||||||||
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